With its eyes on the basic, ultra low cost handset segment, Infineon Technologies has introduced a new set of mobile phone chips that not only optimize system performance five times, but also reduce the Bill-of-materials by almost 10 per cent.
The new chip, called the X-GOLD 102, is billed as a single-chip solution for mobile phones, ably taking care of the GSM Baseband, RF transceiver, mixed signal, power management and RAM in a single chip. At the same time, Infineon also launched the XMM 1028, a dual-SIM platform based on the X-GOLD 102DS, which is a cost-optimized single baseband solution for dual-SIM platforms.
But back to the X-GOLD 102. According to the company, “it supports MP3 audio, color display, FM Radio interface, USB charger and is based on 130nm technology (CMOS SoC) for enhanced monolithic integration. Additionally the XMM1020 platform can be realized in a 4-layer PCB and low via count, in a modem area of less than 5cm(SUB>2 and a component count of less than 50 devices.”
Both the XMM1020 and XMM1028 are already available in volume production.
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