By now, we all know the third-generation iPhone should be launched sometime in mid-2009, and it looks like it will.
The latest reports from Taiwan indicate that assembly suppliers will start shipping brand new iPhones in May.
According to DigiTimes, TSCM (Taiwan Semiconductor Manufacturing Company) landed orders for new iPhone components, including GSM/EDGE power amplifiers, 3.2 Megapixel OmniVision CMOS image sensors and Bluetooth ICs (integrated circuits).
No word yet if the 3.2 MP camera has autofocus, but it’s said that TSCM subsidiaries Xintec and VisEra will “handle the packaging and testing service” and respectively “manufacture on-chip color filters” for its CMOS image sensor.
(this is just a photoshopped iPhone 3G)
Below you have a table with the component suppliers for the upcoming iPhone (courtesy of DigiTimes):
Apparently, the first batch of third-gen iPhones will be of around 5 million units.
Now let’s hope Apple will release the new smartphone in June, as rumored
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