Meizu MX3 PCB prompts speculation about 5.5″ or bigger screen
Among the new Chinese smartphone upstarts like Oppo, Xiaomi, Meizu, Coolpad, etc; – Meizu has been around, or at least known outside China, the longest.
Back in 2007, branching out of mp3 players, Meizu caused quite a stir in phone geek circles by announcing a blatant copy of iPhone, only 4 days after Steve Jobs unveiled the original. Of course, Meizu device was a vaporware, and with only Windows Mobile available as an OS to run it, never got off the ground.
But, with that iPhone copycat announcement, Meizu made a name for themselves in China and were able to fake it for a few years, until Android came around. And then, focusing on the best specs and features, they started making some very interesting smartphones, and won a vocal and impressive fanbase in the home market. Today, each of their upcoming flagships usually receives as much attention and speculation, as any device from Apple, Samsung, or any other major vendor.
Case in point – the new Meizu MX3 handset, with every fan on the lookout for any little hint about the new device. Like the picture of the MX3 printed circuit board, that leaked on Meizu forums yesterday:
Which, after “careful forensic research“, allowed people in the know to conclude that the new Meizu MX3 will actually have a 5.5” or bigger display (since the circuit board is 75mm wide, and can not be fitted into anything smaller, assuming 16:9 aspect ratio of previous phones.) The new device will also support NFC (50% probability), will come with Micro SD card slot (80% probability), removable 2200-2400 mAh battery (90% probability), and definitely won’t have LTE.
The previously leaked Meizu MX3 specs include Samsung’s Exynos 5410 Octa CPU, 2GB of RAM, 1920x1200px display resolution and 8 megapixel camera. It should come with a very narrow bezel, and look a lot like HTC One.
There you have it, a full description of a phone most of you won’t ever get a chance to touch. With probabilities included.
Hope you enjoyed it!